Single-chip DIMM stacks integrated circuits like shingles for greater DRAM efficiency

Cellphone screens may be getting bigger, but the push to shrink all other computing components continues unabated. Invensas is well aware of this, and has come up with new, multi-die memory that promises to be both smaller in size and more capacious than existing DRAM. Called xFD, it mounts integrated circuits in a "shingle-like configuration" on top of one another to accomplish the trick. Such stacking increases speed while reducing power consumption due to much shorter connections between RAM dies than what's found in multi-chip DIMM.

Engadget, Single-chip DIMM stacks integrated circuits like shingles for greater DRAM efficiency